Package Technologies for the 4th Industrial Revolution

The 4th Industrial Revolution with artificial intelligence, autonomous vehicles, robotics, and biotechnology demands power efficient computing devices such as GPU, TPU, and FPGA. To further enhance the performance, advanced System-in-Package (SiP) such as 2.5D and 3D integration technologies are needed to satisfy the high computing and power efficiency requirements. High-performance SiP systems must integrate advanced packaging technologies with both complex signal/power integrity and enhanced thermal solutions. In addition, package developers need to work closely with chip designers at a very early stage of the product development to achieve the target performance and reliability. In this Keynote, Dr. Oh, Vice President of Package Development at Samsung Electronics will start with an overview of the evolution and importance of package technology to meet the needs of emerging high-end computing platforms. Furthermore, a high-performance SiP system with a Fan Out (FO) package is introduced for power efficient mobile platforms. In addition, the extension of the FO package for high-end server applications is discussed. Finally, pros and cons of the FO package compared to 2.5D Si-interposer are discussed.