Development and Prospect of Process Models and Simulation Methods for Atomic Layer Deposition

Thin film deposition is one of the most important processes in IC manufacturing. In this paper, several typical models and numerical simulation methods for thin film deposition and atomic layer deposition are introduced. Several modeling methods based on the characteristics of atomic layer deposition are introduced, it includes geometric method, cellular automata and multi-scale simulation. The principle of each model and simulation method is explained, and their advantages and disadvantages are analyzed. Finally, the development direction of thin film deposition and atomic layer deposition modeling is prospected, and some modeling ideas are also provided.