10106 Study on evaluation method for surface topography of CMP polishing pad based on optical Fourier transform

In the CMP (Chemical Mechanical Polishing) process, the polishing pad is a factor which greatly affects the polishing performance, since the surface shape of contributing to the polishing pad has a very fine and complex shape, the analysis of polishing pad surface is difficult. We have analyzed the polishing pad surface shape by using the method of optical Fourier transform was devised on the basis of the diffraction phenomenon of light. In this study, by altering the incident angle of the laser beam to be irradiated to the polishing pad, we report makes it possible to clarify the difference of the polishing pad surface shape.