Smart in-line defectivity/metrology process control solution for advanced 3D integration

Amina Sidhoum, Nicolas Devanciard,Franck Bana,Arnaud Garnier,Nicolas Bresson,Sandra Bos,Stéphane Rey,Carlos Beitia,Dario Alliata,Darcy Hart, John Thornell,Justin Miller, Gilles Vera, Scott Balak

International Symposium on Microelectronics(2016)

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摘要
Abstract When combined with in-line local metrology, Automatic Visual Inspection/Classification is a powerful tool to characterize 3D interconnect processes, either at the R&D level or in volume manufacturing environments. A new methodology that uses visual inspection results to drive local smart metrology was used for the first time to control the fabrication process of micro-pillar/micro-bump vertical contacts. Quantification of the inspection time when the smart logic concept was used revealed a throughput increase of 23% on average, while consistency of the automatic morphological accuracy was preserved as confirmed by in-line mechanical profilometry. The morphology characterization is discussed with respect to the electrical performances at die level.
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关键词
defectivity/metrology process control solution,advanced 3d integration,in-line
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