Development of MSP5, a High Strength and High Electrical Conductive Solid-solution Copper alloy for Automotive Terminal

Yuki Ito, Kazunari Maki, Takanori Kobayashi, Shinya Koike

Materia Japan(2016)

Cited 1|Views0
No score
Key words
Metal Matrix Composites,Aluminium Alloys
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined