Investigation on some Properties of Renshape^TM SL7545 Type Photosensitive Resin and its Application for Stereolithography Material

In the paper, RenshapeTM SL7545 type photosensitive resin for stereolithography material was characterized by infrared (IR) and nuclear magnetic resonance (NMR) spectroscopy, showing the presence of epoxy and acrylic functional groups, as well as aromatics and aliphatic ether groups. The experimental results showed that its viscosity at 30°C was 350mPa.s, its critical exposure (Ec) was 10.4mJ/cm2, its penetration depth (Dp) was 0.17mm, the tensile strength of its cured product was 41.5MPa, the tensile modulus was 1561MPa, the elongation at break was 14.7%. With the photosensitive resin as the processing material, the part of an active pincers was fabricated using the Stereolithography Apparatus (HRPL-I), and the quality of the fabricated part was good.