Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology（2022）
摘要
The introduction of 5G mobile communication created the need to support a large number of radio frequency (RF) bands. This required high performance and reduced size for microacoustic filters. Based on these requirements, a new three-dimensional wafer-level packaging (3-D WLP) solution based on the predecessors’ developed technology was presented to resolve reliability issues for surface acoustic ...
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关键词
SAW filters,Glass,Packaging,Three-dimensional displays,Acoustics,Stress,Surface acoustic waves
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