CTE-Tailorable Copper Heat Spreaders, Heat Sinks, and Heat Pipes via a nanoCopper Approach

2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC)(2021)

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摘要
Since the last ever ITRS report, published in 2015, acknowledged the end of profitable scaling (Moore's law) the industry's focus has shifted to packaging as the focus area to drive down cost, size and increase performance [1]. Heterogeneous integration was recognized as being the key vehicle to continue miniaturization. However, it requires the combination and close packing of vastly different ma...
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关键词
copper,tunable CTE,heat management,electronics engineering,semiconductors,injection molding
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