Research and Application of Double-sided Thermal Resistance Test Method for Press-pack IGBT

Yihui Zhang,Pengfei Wu,Meiting Cui,Zhongyuan Chen,Yinghan Liu,Jinyuan Li

2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS)（2021）

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摘要

With the acceleration of energy transformation and the development of power grid equipment technology, the capacity and voltage level of flexible DC transmission project are gradually improved. There is an urgent need for the support of power semiconductor IGBT with higher voltage level and larger capacity. As the press-pack IGBT has two heat dissipation surfaces, and the heat dissipation power of...

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