A Hybrid In-die Metrology Solution for High-order Overlay Control and CD Uniformity Improvement

Chi Zhang, Chunjie Zheng,Faquan Liu,Lingyi Guo,Hongwen Zhao,Wenzhan Zhou,Jinyan Song,Chunfei Sui

2021 International Workshop on Advanced Patterning Solutions (IWAPS)（2021）

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Abstract

Overlay (OVL) and critical dimension uniformity (CDU) are two of the most critical process control steps to enable successful semiconductor manufacturing. A typical overlay control scheme uses an overlay feedback loop by measuring the overlay marks placed on the scribe line of the exposure field and returning scanner corrections through sophisticated data modeling. As the number of overlay marks i...

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Key words

Integrated circuits,Semiconductor device measurement,Optical feedback,Process control,Metals,Metrology,Optical variables measurement

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