陶瓷柱栅阵列封装电路器件级热学环境可靠性评估
Electronics and Packaging（2021）
Abstract
陶瓷柱栅阵列(Ceramic Column Grid Array,CCGA)封装器件在宇航型号中已大量使用,在地面高温贮存及空间极冷极热等热应力载荷作用下,极易出现焊点开裂等失效问题,进而引发器件故障.针对外引出端为增强型焊柱的CCGA封装电路,开展器件级高温存储、温度循环及多次返工可靠性考核,评估外引出端为增强型焊柱的CCGA封装电路的热学可靠性.结果表明,器件在2000h高温存储考核后焊点未发生失效,但经历2000次温度循环考核后焊点内部开裂,返工3次后焊点形貌及界面互连未发生明显变化.
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