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A Study on IMC Morphology and Integration Flow for Low Temperature and High Throughput TCB Down to $10\mu \mathrm{m}$ Pitch Microbumps

Jaber Derakhshandeh,Carine Gerets,Fumihiro Inoue,Giovanni Capuz,Vladimir Cherman,Melina Lofrano,Lin Hou,Tom Cochet,Inge De Preter,Tomas Webers,Pieter Bex,Geraldine Jamieson,Masataka Maehara,Ehsan Shafahian,Julien Bertheau,Eric Beyne,Douglas Charles La Tulipe,Gerald Beyer,Geert Van der Plas,Andy Miller

Electronic Components and Technology Conference（2021）

Cited 2|Views4
Key words
IMC insertion bonding,TCB,Low temperature bonding,solid state bonding,spacer and solder bumps,intermetallic compound,3D stacking
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