Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology（2022）
Abstract
Fan-out wafer-level packaging (FOWLP) is one of the most popular microelectronics packaging technologies. Redistribution layers (RDLs) are employed to expand chip pads beyond the chip edges. Photosensitive polyimide (PI) is widely used in RDLs fabrication. But it also introduces some issues during the thermal cycling test or highly accelerated stress test, for example, warpage, peeling, blistering...
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Key words
Surface treatment,Curing,Packaging,Temperature measurement,Surface roughness,Rough surfaces,Plasma temperature
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