Silver sintering technology based on induction heating for chip level bonding

Christian Hofmann,Mario Baum,Maulik Satwara,Martin Kroll,Sushant Panhale,Patrick Rochala, Soumya-Deep Paul,Kiyoshi Oi,Kei Murayama,Maik Wiemer,Harald Kuhn

2021 IEEE CPMT Symposium Japan (ICSJ)（2021）

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Abstract

This paper presents a method for rapid and homogeneous induction heating of micro-scaled silver particle layers to support and enhance the bonding process of microelectronic components at the chip level.

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Key words

chip bonding,induction heating,silver sintering

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