Thin-Film Integrated Passive Device Technology Based Ultraminiaturized Bandpass Filter for 5G Communication Application

Xiao Tan,Cong Wang,Yu-Chen Wei,Alok Kumar

2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)（2021）

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摘要

In this paper, an ultraminiaturized Thin-Film Integrated Passive Device (TFIPD) band-pass filter (BPF) is designed and analyzed for the n77 band of 5G communication application. The proposed BPF offers several characteristics such as low-profile structure, easy onboard integration, and low loss device, which is suitable to incorporate in the RF front-end system. TFIPD technology process offers a h...

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关键词

Thin-film integrated passive device,band-pass filter,5G communication,ultraminiaturized,air bridge structure

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