Modeling Thin 3-D Material Surfaces Using a Spectral-Element Spectral- Integral Method With the Surface Current Boundary Condition

IEEE Transactions on Antennas and Propagation(2022)

引用 2|浏览13
暂无评分
摘要
Thin dielectric or conductive structures are very common in many applications. Modeling such structures in the finite-element method can require a very dense mesh near the structures, which increases the computation cost and degrades the mesh quality. In this work, the surface current boundary condition is incorporated into the framework of the spectral-element spectral-integral method to efficien...
更多
查看译文
关键词
Surface impedance,Boundary conditions,Numerical analysis,Periodic structures,Integral equations,Costs,Surface waves
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要