Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory.

Built in redundancy analysis (BIRA) is used in the manufacturing process for memory yield. However, as the memory density increases, fault occurrence in the memory process is increasing. Thus, it is difficult to handle numerous faults by solely using BIRA. Therefore, the previous studies on using error correction code (ECC) on memory have been actively conducted. In this paper, PRIDE (Post-bond lIne Repair with Double-bit ECC) is proposed. PRIDE uses the double-bit ECC for remaining faults after repairing row lines with the highest number of faults in the post-bond process to achieve high repair rate and reliability in the memory with numerous faults.