An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA.

ISOCC(2021)

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摘要
Three-dimensional (3D) memory is widely developed to fulfill the ever-increasing memory densities. For the high reliability of 3D memory, the traditional spare structures that consist of simple rows and columns have a difficulty to maximize the efficiency of spare allocation. Therefore, various spare structures are adopted to achieve a high repair rate improvement for multiple banks memory. However, the previous studies have not proposed any methodology to allocate various spare structures with BIRA. For this reason, a new effective spare allocation methodology for the pre- bond and the post-bond repair is proposed. Also, the methodology can be verified by six representative various spare structures with the sequential allocation BIRA.
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关键词
3D memory,built-in redundancy analysis (BIRA),hardware overhead,repair rate,analysis time,spare structures
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