110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules.

Kenichi Miyaguchi,Yoojin Ban,Nicolas Pantano, Xiao Sun,Philippe Absil,Lieve Bogaerts,Peter Verheyen,Dimitrios Velenis,Marianna Pantouvaki,Joris Van Campenhout

ECOC（2021）

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摘要

We report Through-Si Via's (TSV) with RF bandwidth beyond 110GHz integrated in a Silicon Photonics interposer, targeting next-generation optical modules operating at 100Gbaud data rates. Showcasing low RF loss, high-quality data transmission is demonstrated at 112Gb/s NRZ data rate for test structures including two TSVs.

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关键词

low RF loss,high-quality data transmission,NRZ data rate,through-silicon via,silicon photonics interposer,next-generation optical modules,RF bandwidth,frequency 110.0 GHz,bit rate 112 Gbit/s,Si

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