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Three-dimensional wavelength-division multiplexing interconnects based on a low-loss SixNy arrayed waveguide grating

OPTICS EXPRESS(2021)

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Abstract
We fabricate three-dimensional wavelength-division multiplexing (3D-WDM) interconnects comprising three SixNy layers using a CMOS-compatible process. In these interconnects, the optical signals are coupled directly to a SixNy grating coupler in the middle SixNy layer and demultiplexed by a 1 x 4 SixNy array waveguide grating (AWG). The demultiplexed optical signals are interconnected from the middle SixNy layer to the bottom and top SixNy layers by four SiOxNy interlayer couplers. A low insertion loss and low crosstalk are achieved in the AWG. The coupling losses of the SiOxNy interlayer couplers and SixNy grating coupler are similar to 1.52dB and similar to 4.2 dB, respectively. (C) 2021 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
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Key words
Board-Level Optical Interconnects,Optical Interconnects,On-chip Interconnects,Optoelectronic Integration,Long-Period Gratings
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