Ultra-Thin Pzt/Si Chip Integrated On Paper Substrates

This paper presents the integration process of an ultra-thin PZT/Si chip on paper and that it functions as a simple speaker by applying a voltage in the audible frequency range. The PZT/Si chip used is only 5 mu m thick, so it does not interfere with the flexibility of the substrate, and it can be integrated on paper because it does not use a high-temperature process in the electrode connection process. We have revealed that a paper with an ultra-thin PZT/Si chip of only 1 x 5 mm(2) in size generates a fully audible sound pressure level (SPL) of about 40 dB. It was rounded to a radius of curvature of 1 cm without breaking. The overall SPL was about the same even when the paper substrate dimension was reduced to 50 mm square. This technology is expected to be applied to electronic components such as surround speakers or haptics in electronic paper.