Effects of infrared radiation on the mechanical properties of an epoxy-amine adhesive using a Central Composite Design method

Recently, the aerospace industry has been facing many challenges, including an increase in the production rates to meet the market needs. In the context of adhesives and liquid shim applications, this means the possibility of on-demand curing. In other words, adhesives must cure slowly at room temperature and this process must be accelerated at any time to allow for the fastest polymerization possible. However, while on-demand curing is possible in several ways (ultraviolet radiation, induction, or microwave), the route chosen in this study is infrared (IR) radiation. This is because this method allows curing at low temperatures (i.e., around 50°C) and is universal, hence requiring no modification in the adhesive formulation.