Characterization And Role Of Deep Traps On The Radio Frequency Performances Of High Resistivity Substrates

In this study, high-resistivity gold-implanted silicon substrates developed for radio frequency (RF) applications were characterized. By varying PICTS (Photo-Induced Current Transient Spectroscopy) measurement conditions such as the illumination wavelength, we identified the signature and the nature of four dominant traps. Two were electron traps and the others were hole traps. All of the related defects involved gold atoms. RF simulations of coplanar waveguide transmission lines integrated on these substrates were carried out, based on the trap properties extracted from PICTS results. A good agreement between RF experimental data and simulations was achieved by tuning the trap concentrations. Finally, the gold density extracted from the fit was successfully compared with the secondary ion mass spectrometry profile and an explanation of the role of the traps in RF behavior of the substrate was given.