Heat-Resistant Polyimides With Low Cte And Water Absorption Through Hydrogen Bonding Interactions

A novel diamine, 1H,1 ' H-(2,2 '-bibenzimidazole)-5,5 '-diamine (DPABZ), containing bisbenzimidazole unit was successfully synthesized, and used to prepare a series of copolyimides BPDA:(ODAm/DPABZn) by polycondensation with 4,4-diaminodiphenyl ether (ODA) and 4,4-biphthalic anhydride (BPDA). For comparison, a series of copolyimides BPDA:(ODAm/PABZn) based on another benzimidazole diamine 5-amino-2-(4-aminobenzene)-benzimidazole (PABZ) was also prepared. As a result, with the increase of PABZ or DPABZ content, the heat resistance (T-g and T-d) and mechanical properties (sigma and E) of the resulting polyimide (PI) films increased, while the coefficient of thermal expansion (CTE) decreased. Overall, the DPABZ-based PIs showed higher T-g values and much lower CTE values than PABZ. As the content of PABZ increased, the water absorption of PABZ-based PIs increased obviously, but no significant change in DPABZ-based PIs. The intramolecular hydrogen bonding in DPABZ-based PIs caused by the diamine DPABZ was believed to be the reason for the aforementioned differences. The BPDA: DPABZ film with low-water adsorption of 2.1%, high-T-g value of 436 degrees C and low-CTE value of 5.4 ppm/degrees C could be a promising new generation of flexible display substrates.