Influence Of Eccentric Nanoindentation On Top Surface Of Silicon Micropillar Arrays

In this paper we present an investigation of the influence of nanoindentation location on the top surface of silicon micro-pillar. This silicon micro-pillar array which will be employed as a micro force sensor array based on three-dimension silicon (3D Si) structures, is fabricated by near UV nanoimprint lithography (NIL) technique and etched by Cryogenic Inductively Coupled Plasma (ICP) sequentially. To determine its mechanical properties, those micropillars are measured by instrument indentation testing (IIT) to obtain its hardness and reduced modulus. For the measurement, a Berkovich diamond indenter is utilized to penetrate a single and also multiple point indentations on a micro-pillar surface. Afterwards, these results are compared to the indentation at the central point of the tested pillar and Si bulk as its reference to examine the influence of different probing locations on the measured reduced modulus and hardness.