Experimental Study Of The Thermal Contact Resistance At Low-Temperature

The thermal contact resistance (TCR) of the substrate and component is an important parameter in cryogenic applications. In the paper, the laser photothermal method (LPM) is used to measure the TCR between copper and stainless steel 304. The LPM can complete the measuring in ten seconds, even to several seconds. The measurement results show that: i the TCR is inversely proportional to the temperature in the range of 20 K to 300 K; ii increasing of the contact pressure will decrease the TCR at pressure of 0.2 MPa to 0.68 MPa; iii the variation tendencies of the TCR with the contact pressure and contact force are in a substantial agreement.