Hybrid IlI-V/silicon photonic integrated circuits for optical communication applications

2016 IEEE 13th International Conference on Group IV Photonics (GFP)(2016)

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摘要
This paper reports on recent advances on hybrid III-V on silicon integration using a wafer bonding technique. In particular, directly modulated hybrid laser with or without an external filter and integrated laser — electro-absorption modulators are discussed.
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关键词
hybrid IlI-V/silicon photonic integrated circuits,optical communication,silicon integration,wafer bonding technique,directly modulated hybrid laser,external filter,integrated laser,electro-absorption modulators,InP-Si
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