Adhesiveness evaluation of heat-resistance thermosetting imide molding plastic for SiC power device package with power cycling test
2016 6th Electronic System-Integration Technology Conference (ESTC)（2016）
Abstract
It is required to ensure the reliability of package in high temperature operation to effectively utilize SiC power device which can operate in temperature higher than 200°C. This study evaluates and compares the adhesiveness of the developed heat-resistant molding plastic for SiC power module in high temperature power cycling test.
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Key words
adhesiveness evaluation,heat-resistance thermosetting,imide molding plastic,power device package,package reliability,power module,high temperature power cycling test,SiC
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