Package thickness - how low can you go with WLFO

NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array (eWLB) [1]. Since it's invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution to wafer format of semiconductor dies or other active / passive components separated by mold compound applied through compression molding on a temporary mold carrier. The resulting wafer can be processed in standard wafer processing equipment. One of the challenges for the future of semiconductor packaging is reduction of the board level volume real estate occupied by each component. With the drive towards lower profile end user devices incorporating large display area and battery life the three dimensional available for semiconductor packages is diminishing. It is well known that WLFO enables the shrinkage of the XY footprint of the package through flexible very dense heterogeneous system-in-package integration [2]. WLFO also permits reduction of the overall package height (Z). A total package height for a BGA package <;500um is achievable and <;300um for LGA.