Hybrid Large-Area Systems And Their Interconnection Backbone

Hybrid systems combine Large-Area Electronics (LAE) with high-performance technologies (e.g., silicon CMOS) [1]. With architectural concepts for hybrid systems broadening to match the range of emerging applications, this paper examines modular approaches for multi-sheet, multi-technology integration. It identifies the interfaces required as a critical backbone. For interfaces associated with various system functionalities (sensing, processing, powering), specific approaches are surveyed and analyzed, taking from insights derived from several previous experimental demonstrations of complete hybrid systems.