Novel fabrication of low-cost Ti-Cu alloy by electroless copper plating and vacuum sintering
VACUUM（2021）
Abstract
We report a novel fabrication method of low-cost Ti-Cu alloy. Cu coated Ti powders with core-shell structure are prepared by electroless copper plating of spherical Ti powders. The growth mechanism of core-shell Ti@Cu powders is illustrated. The sintered Ti-Cu alloy exhibits excellent mechanical properties due to the homogeneous distribution of the fine Ti2Cu particles in the Ti matrix after sintering treatment.
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Key words
Spherical Ti powder,Electroless Cu plating,Growth mechanism,Sintering,Microstructure
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