Segregation engineering of grain boundaries of a metastable Fe-Mn-Co-Cr-Si high entropy alloy with laser-powder bed fusion additive manufacturing

Laser-powder bed fusion (L-PBF) additive manufacturing offers unprecedented microstructural fine-tuning capabilities. Naturally, benefitting from such capability requires alloys that are amenable to microstructural heterogeneity and hierarchy (MHH) and that exhibit a low hot-cracking susceptibility (HCS). However, columnar growth, which is characterized by capillary effects and poor strain accommodation capabilities, is prevalent in L-PBF and increases the HCS of the processed alloys. Further, while solute segregation is prominent in cellular and dendritic growth modes during L-PBF, the effects of solute segregation on the alloy HCS and L-PBF processing window remain widely unexplored. Here, we demonstrate that solute segregation affects columnar growth, grain coalescence behavior during solidification, MHH and mechanical properties of a metastable Fe40Mn20Co20Cr15Si5 (at.%) high entropy alloy (CS-HEA) doped with 0.5 wt.% B4C (termed CS-BC). A theoretical framework is proposed, which reveals that a boundary strengthening segregant may reduce the alloy HCS during L-PBF. In as-built CS-BC, boron, a boundary strengthener, segregated to the solidification cell boundaries, whereas carbon remained in the solid solution. The as-built CS-BC exhibited suppressed columnar growth, more random texture, smaller cell size and higher strength as compared to the as-built CS-HEA. Further, a wide crack-free L-PBF processing window of CS-BC allowed fine-tuning of its MHH and thus the mechanical properties. Upon annealing, as carbon-containing precipitates formed, CS-BC exhibited a metastable microstructure and transformation induced plasticity effect, which led to high synergistic strength-ductility. These findings will foster design of alloys that facilitate application-specific manufacture with L-PBF and thus, an extended outreach of L-PBF for structural applications. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.