Wetting Of Aluminum And Copper Substrates By Lead - Nickel Melt

A. Kh Shermetov,A. A. Shokarov,M. Kh Ponezhev, A. Sozaev,B. S. Karamurzov

PHYSICAL AND CHEMICAL ASPECTS OF THE STUDY OF CLUSTERS NANOSTRUCTURES AND NANOMATERIALS（2018）

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摘要

In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb-Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts.

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关键词

wetting angle, aluminum, nickel, copper, temperature of wetting threshold

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