Mis-registration of Sliver Type Backdrill Impact in High Speed Signal Propagation

Han Gao,Soumya De, Brent Beingessner,Steve Payne,James Drewniak

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)（2018）

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摘要

Nowadays, plated-through hole (PTH) via structures are extensively used in printed circuit boards (PCBs). As the data rate increases to Gigahertz range, the via stub resonance effect shows up, which will cause signal distortion and lead to signal integrity issue. In this paper, the impact caused by backdrill mis-registration issue is investigated.

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关键词

plated-through hole,PCB,mis-registration,backdrill,via stub,S-parameter,TDR,sliver

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