Lakefield And Mobility Compute: A 3d Stacked 10nm And 22ffl Hybrid Processor System In 12x12mm(2), 1mm Package-On-Package Wilfred Games,Sanjeev Khushu,Doug B. Ingerly,Patrick N. Stover,Nasirul Chowdhury,Frank O'Mahony,Ajay Balankutty,Noam Dolev,Martin G. Dixon,Lei Jiang,Surya Prekke,Biswajit Patra,Pavel Rott,Rajesh Kumar2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)（2020）引用 0|浏览1暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
