Reliability And Process Optimization Of Multilayer Ceramic Electrical Interconnection

To study the influence and related effects of multilayer ceramic electrical interconnection process for stress magnitude and distribution properties, this paper used finite element analysis software ANSYS WORKBENCH to establish a variety of multi-storey vertical interconnect vias extreme boundary model. The invalid stress problems of interconnecting vias and the stress of high-density adjacent pitch between interconnect vias were analyzed, and the thermal stress in the sintering process was simulated. Furthermore, the key factors which can influence the reliability of the low temperature co-firing ceramic (LTCC) interconnection via were discussed, and the optimization methods for improving the process reliability of the LTCC passive integrated interconnection via were proposed.