Dynamic Fsi Simulation Of Pin Transfer Process For Solder Paste Transport

This paper is aimed to simulate the pin transfer process for solder paste to determine the viability of this technique to perform as an alternative to other solder paste deposition technique such as stencil printing. A model of fluid-structure interaction is designed to model the pin transfer process where the pin dipped into the solder bath and picking up the solder paste. Based on the previous study, it is found that the design of the pin nozzle exhibits certain limitations which is the consistency of the volume of solder paste transfer as well as the desire texture of the solder paste displace onto PCB pad. Different size and type of components require a designated pin to perform the pin transfer process. The development of the pin nozzle design is a time consuming process. An introduction of the pin transfer process simulation model managed to facilitate the designing process and reduce the time taken. In this research, the process of dipping the pin nozzle into the solder paste bath is study with dynamic mesh. The dipping process of the pin nozzle in simulation required a fine meshing to ensure the high accuracy of the simulated outcome. Moreover, the optimum time step size for the pin dipping process simulation is determined in the study. Generally, the implementation of the pin transfer process simulator, the design process of the pin can be improved with an increasing efficiency and productivity process which is beneficial to the industry.