Vacuum Packaging Technology Using Localized Aluminum/Silicon-To-Glass Bonding
14TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST（2001）
Abstract
A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, similar to0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive mu -resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged mu -resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A mu -resonator with Q of similar to 9600 has been vacuum encapsulated and shown to be stable after 7 weeks.
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Key words
Q-factor,aluminium,encapsulation,micromechanical resonators,microsensors,packaging,pressure sensors,silicon,25 mtorr,3.4 W,Al-Si,MEMS device,Q-factor,aluminum/silicon-to-glass bonding,folded beam comb drive microresonator,packaging technology,pressure monitor,vacuum encapsulation,
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