Experimental Research Of The Influence Of The Anodic Bonding Current On The Bonding Strength

Chun-Yi Lu,Ming-Qiang Pan,Li-Guo Chen, Meng Zhuang

PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MECHANICS AND MECHATRONICS (ICMM 2015)(2016)

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摘要
In order to find out the relationship between the bonding current and the bonding strength, four sets of experiments, each contains 200 samples, were done with the bonding current limited to 0.05mA, 0.25mA, 0.45mA and 0.65mA respectively. The qualified rate, mean value and standard deviation of the bonding strength measured subsequently were chosen to judge the influence of the bonding current on the bonding strength. The results show that the bonding strength under lower limiting current is determined by the interfacial region, while under higher limiting current, the bonding strength is determined by the glass. With the increase of the limiting current, the qualified rate and mean value of the bonding strength increase first and then decrease, while the standard deviation of the bonding strength first decreases and then increases. Limiting the bonding current is beneficial to improve the qualified rate and stabilize the bonding strength.
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关键词
Anodic bonding,Bonding current,Bonding strength
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