Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

Cheng-Ta Ko,Kai-Ming Yang,Jim-Wein Lin,Chih-Lun Wang,Tzu-Chieh Chou,Yu-Tao Yang,Ting-Yang Yu,Yu-Hua Chen,Kuan-Neng Chen,Tzyy-Jang Tseng

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2017）

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摘要

In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).

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关键词

low temperature bonding,RDL-first fan-out panel level package,pillar-concave structure,polymer layer,low-stress release layer,laser ablation,glass panel,re-distribution layer process,Cu

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