New flip-chip bonder dedicated to direct bonding for production environment

2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)(2018)

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Abstract
3D vertical integration of components is today an industrial reality. To reduce pitch of interconnection between the dice, the hydrid bonding technique, offering sub-10 m interconnection pitch, is widely demonstrated for Wafer-to-Wafer bonding. Die-to-Wafer direct bonding remains today more challenging due to additional particle contamination and handling complexity but presents interesting assets. The purpose of this paper is to demonstrate the performance of a fully automated Die-to-Wafer bonder, SET FC1, specifically designed for direct bonding dedicated to production. After a description of the process and the elements developed specially for this process, it will be demonstrated that an accuracy of 1 fun can be reached today with a throughput up to several hundred dice per hour. If progresses still need to be done, the particle contamination is low enough to enable demonstration of oxide/oxide Die-to-Wafer direct bonding. Considering the results obtained until now, industrialization appears feasible.
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Key words
Flip-Chip, High Precision, High Throughput, Fine Pitch, Direct Bonding
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