Heat Capacitive Pcb

Jonathan Silvano De Sousa, Sabine Liebfahrt, Bernhard Reitmaier, Maria Prutti, Bernd Schuscha, Qi Tao,Johann Nicolics,Michael Unger,Paul Fulmek

2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)（2018）

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摘要

This paper describes a heat capacitive PCB concept where phase change materials (PCMs) embedded in an epoxy resin matrix is used. A heat dissipating component is installed on the surface of the PCB containing phase change material filled cavities. During phase change, part of the dissipated heat is absorbed by the PCB with the effect of reducing the operational temperature for the component and expanding the time until the system has reached steady state maximum temperature.

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关键词

PCM, Phase Change, PCB, Thermal Management, Latent Heat, embedding technology

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