High-Density Patterned Array Bonding Through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process
Polymers（2021）
关键词
DVS-BCB bonding mechanism,DVS-BCB bonding,adhesive,void-free DVS-BCB bonding,pressure condition
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要