Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling.

Herein, Pebax functionalized h-BNNSs (P-BNNSs) fabricated by a mechanical exfoliation and in-situ modification process are employed to improve the thermal conductivity and antiwear performance of epoxy resin (EP). Pebax can effectively improve the dispersibility of P-BNNSs, achieving hierarchical assembly of P-BNNSs in EP matrix during EP curing process to form a multinetwork structure only at a low P-BNNS filling contents (≤6 wt%). This multinetwork structure can act as excellent heat conductive pathways to realize simultaneously vertical and horizontal heat diffusion, obtaining quasi-isotropical thermal conductive P-BNNS/EP composites. Fascinatingly, a through-plane thermal conductivity of 3.9 W/(m·K) and an in-plane thermal conductivity of 2.9 W/(m·K) are obtained. More importantly, this special structure can simultaneously improve the antiwear, mechanical and electrically insulating performances of pure EP. The friction coefficients and wear rates of P-BNNS/EP composites (P-BNNS contents ≤ 6 wt%) are dramatically decreased to less than 0.2 and 1 × 10-5 mm3/(N·m), comparing with those of pure EP which are over 0.6 and 2 × 10-5 mm3/(N·m), respectively. The enhanced tensile stress of over 110 MPa and electric volume resistivity of over 1.50 × 1013 Ω·cm are also observed for P-BNNS/EP composite films. These improved properties make the P-BNNS/EP composites very promising as packaging or heat dissipation materials in the high density integration systems and high frequency printed circuit boards.