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Compact SPICE Model of Topological Textures on Magnetic Racetracks for Design Space Exploration

2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)(2021)

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摘要
Magnetic Topological Textures (MTTs) have the potential to become the building block of future memory and logic-in-memory devices due to their compact size and non-volatility. However, these MTTs are used in conjunction with the CMOS control circuit to design memory and logic-in-memory devices. Micromagnetic and SPICE simulations need to be carried out separately for MTT and CMOS, respectively, to...
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关键词
Semiconductor device modeling,Performance evaluation,Computational modeling,Magnetic separation,SPICE,Semiconductor process modeling,Space exploration
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