Compact SPICE Model of Topological Textures on Magnetic Racetracks for Design Space Exploration
2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)(2021)
摘要
Magnetic Topological Textures (MTTs) have the potential to become the building block of future memory and logic-in-memory devices due to their compact size and non-volatility. However, these MTTs are used in conjunction with the CMOS control circuit to design memory and logic-in-memory devices. Micromagnetic and SPICE simulations need to be carried out separately for MTT and CMOS, respectively, to...
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关键词
Semiconductor device modeling,Performance evaluation,Computational modeling,Magnetic separation,SPICE,Semiconductor process modeling,Space exploration
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