NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis
2021 58th ACM/IEEE Design Automation Conference (DAC)(2021)
摘要
Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP si...
更多查看译文
关键词
Backpropagation,Semiconductor device modeling,Design automation,Neural networks,Very large scale integration,Filling,Manufacturing
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要