NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis

2021 58th ACM/IEEE Design Automation Conference (DAC)(2021)

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摘要
Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. This paper proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP si...
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关键词
Backpropagation,Semiconductor device modeling,Design automation,Neural networks,Very large scale integration,Filling,Manufacturing
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