Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Cu-Sn SLID is an increasingly popular bonding technique with applications in such as hermetic sealing of microbolometers. A moderate bonding pressure is necessary to compensate for the surface roughness of the electroplated layers and to break the Sn oxide layer, thereby reducing the risk of voiding. However, such bonding pressures increase the risk for Sn squeeze-out during the bonding process, w...