Optimized Packaging Solutions for Multi-Emitter Laser Modules

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)(2021)

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摘要
Packaged high-power diode lasers have applications in many areas ranging from optoelectronic high density data storage, high power industrial laser for material processing, to medical (chirurgical/aesthetical) applications. The paper presents the development of families of laser modules which, using the same platform and assembly lines, can achieve a specific combination of power, brightness, comp...
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关键词
Costs,Semiconductor lasers,Power lasers,Memory,Packaging,Distance measurement,Materials processing
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