The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics

Avram Bar-Cohen,Mehdi Asheghi,Timothy J. Chainer,Suresh V. Garimella,Kenneth Goodson,Catherine Gorle,Raphael Mandel, Joseph J. Maurer,Michael Ohadi,James W. Palko,Pritish R. Parida,Yoav Peles,Joel L. Plawsky,Mark D. Schultz,Justin A. Weibel,Yogendra Joshi

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

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摘要

The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012–2015 to target an order of magnitude improvement in chip level and hot spot heat fluxes, compared to the then state-of-the-art (SOA). Evaporative cooling technologies to achieve potential targets of 1 kW/cm更多

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关键词

Heating systems,Substrates,Cooling,Heat sinks,Heat transfer,Pins,Thermal management

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