Delamination Reduction by Material and Process Optimization

Tina Li,Aaron He,Phoebe Chen, Aaron Lai, Yuan Hang,Colin Feng

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)（2021）

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摘要

With bonding wire converted from Au to Cu, corroded Cu wedge defects observed with some packages. Epoxy Mold Compound (EMC) to lead frame delamination provide penetration path for corrosive chemicals to penetrate inside and react with Cu wedge. To improve delamination performance without changing exist production and Bill of Materials, study was carried out with molding process, Lead Frame strip's...

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关键词

Viscosity,Strips,Wires,Lead,Electromagnetic compatibility,Resource management,Delamination

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